H531C

• Product Features

  UMTS, LTE Band
  PCB Soldering Re-flow
  Wide Operation Temperature Range -40 ~ 85℃
  Compact Package Design for PCB Applications

• Size Display

  

• Specification Parameters

  Model		Frequency（GHz） F1	Frequency（GHz） F2	Center Frequency (GHz)	Bandwidth （GHz）	Isolation （dB）MIN	INS LOSS （dB）MAXen	VSWR MAX	Power (W)	IMD (@2X43dBm) (-dBc)MAX
  H531C[5790-5890]MHz											5.790	5.890	5.8500	0.100	23	0.3	1.17	20	-
  H531C[3400-3700]MHz		3.400	3.700	3.5500	0.300	21	0.4	1.2	50	-
  H531C[3.3-3.36]MHz		3.300	3.360	3.3300	0.060	22	0.3	1.17	100	-