H532B
-
Product Features
UMTS, LTE Band
PCB Soldering Re-flow
Wide Operation Temperature Range -40 ~ 85℃
Compact Package Design for PCB Applications -
Size Display
-
Specification Parameters
Model
Frequency（GHz）
F1Frequency（GHz）
F2Center Frequency
(GHz)Bandwidth
（GHz）Isolation
（dB）MININS LOSS
（dB）MAXenVSWR
MAXPower
(W)IMD
(@2X43dBm)
(-dBc)MAXH532B [2110-2170]MHz 2.110 2.170 2.140 0.060 25 0.2 1.12 250 -75 H532B [1930-1995]MHz 1.930 1.995 1.963 0.075 23 0.25 1.15 300 -75 H532B [1805-1880]MHz 1.805 1.880 1.838 0.075 23 0.25 1.15 300 -75 H532B [925-960]MHz 0.925 0.960 0.9425 0.035 25 0.2 1.12 250 -75 H532B [758-803]MHz 0.758 0.803 0.7805 0.045 25 0.2 1.12 250 -70 H532B [700-740]MHz 0.700 0.740 0.7200 0.040 22 22 0.25 100 -70 H532B [600-700]MHz 0.600 0.700 0.6500 0.100 23 0.35 1.15 200 -65 H532B [600-684]MHz 0.600 0.684 0.6420 0.084 20 0.35 1.2 100 - H532B [566-678]MHz 0.566 0.678 0.6215 0.112 18 0.45 1.28 200 - H532B [566-600] MHz 0.566 0.600 0.5830 0.034 23 0.25 1.15 200 -
