H504B
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Product Features
UMTS, LTE Band
PCB Soldering Re-flow
Wide Operation Temperature Range -40 ~ 125℃
Compact Package Design for PCB Applications -
Size Display
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Specification Parameters
Model
Frequency（GHz）
F1Frequency（GHz）
F2Center Frequency
(GHz)Bandwidth
（GHz）Isolation
（dB）MININS LOSS
（dB）MAXenVSWR
MAXPower
(W)IMD
(@2X43dBm)
(-dBc)MAXH504B3.5[2110-2170]MHz 2.110 2.170 2.1400 0.060 25 0.2 1.12 250 -75 H504B3.0[2110-2170]MHz 2.110 2.170 2.1400 0.060 25 0.2 1.12 250 -75 H504B3.5[1795-1890]MHz 1.795 1.890 1.8425 0.095 25 0.2 1.12 250 -75 H504B3.0[1795-1890]MHz 1.795 1.890 1.8425 0.095 25 0.2 1.12 250 -75 H504B3.5[925-960]MHz 0.925 0.960 0.9425 0.035 25 0.2 1.12 250 -75 H504B3.0[925-960]MHz 0.925 0.960 0.9425 0.035 25 0.2 1.12 250 -75 H504B3.0[850-900]MHz 0.850 0.900 0.8750 0.050 25 0.2 1.12 250 -72 H504B3.5[850-900]MHz 0.850 0.900 0.8750 0.050 25 0.2 1.12 250 -70
