H103C
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Product Features
UMTS, LTE Band
PCB Soldering Re-flow
Wide Operation Temperature Range -45 ~ 125℃
Compact Package Design for PCB Applications -
Size Display
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Specification Parameters
Model
Frequency（GHz）
F1Frequency（GHz）
F2Center Frequency
(GHz)Bandwidth
（GHz）Isolation
（dB）MININS LOSS
（dB）MAXenVSWR
MAXPower
(W)IMD
(@2X43dBm)
(-dBc)MAXH103CZ6.05G 6.025 6.080 6.0525 0.055 22 0.3 1.17 50 -60 H103CZ5.94G 5.925 5.950 5.9375 0.025 22 0.3 1.17 50 -60 H103CZ5.5G-A 5.150 5.925 5.5375 0.775 22 0.35 1.17 50 -60 H103CZ4.7G 4.400 5.000 4.7000 0.600 20 0.4 1.17 50 -60 H103CZ4.5G 4.400 5.000 4.7000 0.600 22 0.35 1.17 50 -60 H103CZ3.6G 3.400 3.800 3.6000 0.400 20 0.3 1.22 50 -60 H103CZ3.5G 3.400 3.600 3.5000 0.200 22 0.3 1.17 50 -60 H103CZ2.6C 2.486 2.700 2.5930 0.214 22 0.3 1.17 50 -60 H103CZ2.6B 2.545 2.665 2.6050 0.120 27 0.3 1.12 50 -68 H103CZ2.6G 2.545 2.665 2.6050 0.120 25 0.25 1.12 50 -60 H103CZ2.3A 2.260 2.440 2.3500 0.180 25 0.3 1.11 50 -68 H103CZ2.3G 2.300 2.400 2.3500 0.100 20 0.3 1.17 50 -60 H103CZ2.2G 2.250 2.280 2.2650 0.030 23 0.25 1.15 50 -62
